Terahertz Research

Thin-film testing

Chip testing

Volume screening

Application areas:

• Metamaterials
• Plasmonics
• Passive devices
• Emitters
• Antennas
• Waveguides
• Sensor surfaces
• Graphene

Benefits:

• Near-field access
• Cost-efficient system extension
• High-sensitivity
• Low-invasiveness
• Polarisation sensitive
• Broadband

Application areas:

• Solar cells
• Displays
• Flexible electronics
• Semiconductors 
• Graphene
• Transparent conductors

Benefits:

• Sheet resistance imaging
• Contactless
• Micron-scale resolution
• Large-area scanning
• High-speed scanning

 Application areas:

• Time-domain reflectometry
• Fault isolation
• Packaging level inspection
• 3D integration
• Through silicon via (TSV)

 Benefits:

• Market leading TDR resolution
• Sub-ps rise-times
• Contactless
• Non-destructive
• Cost advantage over all-electronic systems

 Application areas:

• Plastic laser weld seam inspection
• Fiber inforced polymers
• Chip underfill inspection
• Organic layer screening

Benefits:

• Non-destructive
• Fast inspection
• Screening of Vis/IR opaque plastics
• Detection of micron-scale structures