Non resist coating

• Applications
  • Planarizing Layer
    • for use in etchback processes to transfer planar topology into an underlying dielectric
  • Mechanical Protective Coating
    • for use in protecting vital components during sawing and dicing operations
  • Temporary Gluing Layer
    • easily removable temporary adhesive layer for use in temporary bonding, back grinding or backside processing applications
• Properties
  • Superb planarizing capability
  • Compatible with resist coaters
• Impact on productivity
  • Elimination of Chemical Mechanical Polishing (CMP) in some applicatios
  • Suppression of microloading effects in etchback process
  • Elimination of film peeling and cracking during dicing operations
  • Easy removal in Resist Developer RD3 or RD6 after back grinding and wafer separation

Spin-On Glass Coatings

• Applications
• Smoothing layer as a part of dielectric in multilevel metal process
• Protective coating
• Intermediate coating in trilayer resist process
• Properties
• Compatible with spin coating techniques
• Shelf-life exceeding 3 years at room temperature
• Good adhesion to polymers
• Lack of solubility in common solvents after curing at temperatures lower than 100°C
• Compatible with typical resist coating equipment and no need for SOG coaters
• Impact on productivity
• Elimination of CVD SiO2 in some applications
• Elimination of time consuming deposition and etchback of SiO2 to fill narrow tranches in multilevel metal process
• Elimination of polishing in preparation of substrates for thin film magnetic head fabrication

Spin-On Dopants

• Applications
  • Spin-on boron source [a-Si, c-Si applications]
  • Spin-on phosphorus source [a-Si, c-Si applications]
  • Spin-on zinc source [III/V substrates]
• Properties
  • Transparent film converted to solid-state dopant upon application of oxygen plasma
• Impact on productivity
  • Elimination of doped spin-on glasses
  • Elimination of ion implantation in some applications
  • Elimination of zinc doping from ampoule