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Positive Photoresists

Positive Photoresists

Positive Photoresists

 

Positive Photoresists
Resist
PR1-1000A
PR1-2000A
PR1-4000A
PR1-12000A		 Thickness
0.7μm - 2.1μm
1.4μm - 4.2μm
2.8μm - 15.0μm
11.8μm - 24.5μm
Temperature resistance < 130°C

 

  • Applications
    • Enhanced adhesion positive resists for dry/wet etching, plating or ion implant.

 

 

Typical profile for Futurrex Positive Resist PR1-4000A
Thickness = 10μm

 

 

Positive Photoresists Developable in a Basic Water Developer:
General Purpose Resists
Thickness Range: 0.7 - 3 micrometers
Performance:
  • No HMDS or adhesion promoters necessary
  • Effective suppression of reflective notching
  • Elimination of sensitizer sublimation, which prevents clogging in bake exhaust lines
  • Superior resolution capability.
  • Short exposure time.
  • Short developmenttime.
  • Superior temperature resistance.
  • Easy resist removal in Resist Remover RR4.
  • Shelf life exceeding 1 year in storage at room temperature.
Applications:
  • Etching, ion implantation, metal plating in fabrication of:
    • integrated circuits
    • MEMS
    • flat panel displays
    • high density packaging

 

Thick Resists
Thickness Range: 3 - 25 micrometers
Performance:
  • Superior resolution capability.
  • Fast photo speed translates into high exposure throughput.
  • Short development time.
  • Superior selectivity in RIE process.
  • Easy resist removal in Resist Remover RR4.
  • Shelf life exceeding 1 year in storage at room temperature.
Applications:
  • Metal plating, ion implantation in fabrication of
    • integrated circuits
    • MEMS
    • flat panel displays
    • high density packaging

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