LOR Lift-off Resists
Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.
- High thermal stability: Tg ∼190C
- Enables sub 0.25µm bi-layer resist imaging
- Single step development of bi-layer stack in TMAH or KOH developers
Ancillaries:
- MCC Developers
- Remover PG
- MCC Thinner
- EBR-PG
Applications
- Cantilevers
- Bi-layer Lift-off
- T-gates
- Microlenses
- Airbridges